Previous (2012) Technical Conference Program

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• INJ-K Block

  

  INJ-K Keynote Session

  Jan. 18 [Wed] 13:30-15:00 Industry Leaders' View: Strength of "Japan's Manufacturing Technologies"

  Perspective Direction for Electronic System View from Super High Band Communication	Fujitsu's Technology that Developed the "K Computer"
  Kanji Otsuka Emeritus Professor, Advisor, Collaborative Research Center of Meisei University	Hideyuki Saso Corporate Senior Executive Vice President, Fujitsu Ltd.

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  ＜Other Sessions＞

  All Sessions Available in English / Japanese

• INJ-1 Development of Pb-free Soldering Options and Reliability Jan. 18 [Wed] 9:30-12:00	INJ-6 Current Market and Technical Trends of Touch Panels with Rapidly-growing Applications Jan. 18 [Wed] 9:30-12:00
  Environmental Technology Chief Initiative, Process Engineering Group, Process Development Div., Senju Metal Industry Co., Ltd. Kiichi Nakamura Professor, Department of Mechanical System Engineering, Graduate School of Engineering, Gunma University Ikuo Shohji (ex-Professor of Tokai University), Research Lab. Tsukui Tsutomu Tsukui	Vice General Manager, R&D, IOPT Technology Co., Ltd. Yoichi Ono Consultant, Ukai Display Device Institute Yasuhiro Ukai Deputy Director, Flexible Electronics Technology Div., ITRI Lu Chih-Chiang

• INJ-2 Latest Trends of Micro-bump and Interconnection Technologies Jan. 19 [Thur] 9:30-12:00	INJ-7 Perspectives and Challenges of Automotive Electronic Mounting Jan. 19 [Thur] 9:30-12:00
  Researcher, Electronic & Optical Packaging, Tokyo Research-Tokyo, IBM Japan, Ltd. Kazushige Toriyama Associate Professor, Institute for Nanoscience and Nanotechnology, Waseda University Jun Mizuno Central Research Lab., Technology & Development Div., Kanto Chemical Co., Inc. Tomoaki Tokuhisa	Director, Electronics Advanced Key Technology R&D Div., Electronics System Business Group, Denso Corp. Yukihide Niimi Manager, Production Technology Div., Process Technology Development Dept., CMK Corp. Noriyuki Saitoh Field Marketing Manager, Marketing Div., Mentor Graphics Japan Co., Ltd. Sam Sawada

• INJ-3 High-quality Production System in Mounting Process and Recent Updates on Advanced Testing & Analysis Technology Jan. 19 [Thur] 13:30-16:00	INJ-8 Forefront of Power Device Mounting and Heat Radiation Technologies Jan. 19 [Thur] 13:30-16:00
  Councilor, High-quality Production System Development Group, R&D Center, Panasonic Factory Solutions Co., Ltd. Masafumi Inoue Section Manager, MED Equipment Sales Sec., Display Systems Sales Dept., Display System Div., Electronics Div., Toray Engineering Co., Ltd. Kozo Hitomi Senior Supervisor, Scientific Systems Team, Sales Dept.2, Systems Sales & Marketing Div., Marubun Corp. Naoki Seimiya	Chief Researcher, R&D Center, R&D Partnership for Future Power Electronics Technology Yoshinori Murakami Group Leader, Materials Characterization Dept., Central Research Institute, Denki Kagaku Kogyo Kabushiki Kaisha Kenji Monden Project Manager, Smart Grid Initiative, Senju Metal Industry Co., Ltd. Hayato Hiwatashi

• INJ-4 Leading-edge Technology for Further-evolving Printed Electronics Jan. 20 [Fri] 9:30-12:00	INJ-9 Striking Progress of Smart Phone Mounting Technology Jan. 20 [Fri] 9:30-12:00
  Professor, Institute of Scientific and Industrial Research, Osaka University Katsuaki Suganuma Managing Director, DKN Research, LLC Dominique K. Numakura Professor, Research Center for Organic Electronics, Yamagata University Shizuo Tokito	Independent Technology Journalist Kenji Tsuda President, Advanced Interface Technology Corp. Kazunori Kato Deputy General Manager, EOMIN Product Dept., Integrated Module & Device Business Headquarters, Taiyo Yuden Co., Ltd. Masashi Miyazaki

• INJ-5 Nanoparticle Manufacturing and Fine-pitch Mounting Technologies Jan. 20 [Fri] 13:30-16:00	INJ-10 LED Device Mounting Technology and its Development Trends Jan. 20 [Fri] 13:30-16:00
  Chief Counselor, Chiba Institute for Super Materials, ULVAC, Inc. Masaaki Oda Senior Researcher, New Business Dept. DOWA Electronics Materials Co., Ltd. Keiichi Endoh Executive Director, Osaka Municipal Technical Research Institute Masami Nakamoto	Managing Director, Grand Joint Technology Ltd. Tetsuya Onishi Director, Engineering, Business Unit Mid Power, Philips Lumileds Lighting Company, Philips Electronics Japan, Ltd. Tomonari Ishikawa Manager, LED Project 3 Team, New Business Incubation Office, Panasonic Factory Solutions Co., Ltd. Masaru Nonomura Manager, Research, Metal Finishing, Okuno Chemical Industries Co., Ltd. Junichi Katayama

• All Sessions

  All Sessions Available in English / Japanese
  (*Keynote Sessions: English, Chinese, Korean & Japanese.)

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  ＜Concurrent Shows: Keynote Sessions＞

• ICP-K Block (For other Exhibit)

  

  ICP-K Keynote Session

  Jan. 19 [Thur] 10:00-11:30 Future Outlook of Semiconductor Business -Keys to Enhance Electronics Industry-

  Session Leader： Toshihiko Sato, Renesas Kyushu Semiconductor Corp. Assistant Leader： Jun-ichi Kasai, SKLink Co., Ltd.
  Evolution of Semiconductor: For Future Society and New User Experience	Amkor Strategy for Packaging Technology
  Tsuyoshi Abe Director and Vice President, and General Manager of Technology & Manufacturing Group, Intel K.K.	Choon-Heung Lee Corporate Vice President, Head of Corp. Technology HQ, Amkor Technology Korea, Inc.

  
  

• PWB-K Block (For other Exhibit)

  

  PWB-K Keynote Session

  Jan. 19 [Thur] 13:30-15:00 Top Manufacturers Reveal their Strategies and Future Visions

  Session Leader： Hirofumi Matsumoto, Nippon Mektron, Ltd. Assistant Leader： Koji Ikawa, CMK Corp.
  BMW i–products and Services for Urban Mobility	Evolution of Mobile Data Devices
  Bernhard Blaettel Director, Project Mobility Services, BMW AG	Shigeyoshi Shimotsuji General Manager, Cloud & Solutions Div., Toshiba Corp.

• CAR-K Block (For other Exhibit)

  

  CAR-K Keynote Session

  Jan. 18 [Wed] 10:30-12:30 Leading Manufacturers Discuss Future Automotive Electronics for Next-generation Vehicles

  Rapidly Changing Automotive Industry and its Expectations for Car Electronics	Volkswagen Group Strategy for Electric Mobility	Ford's Sustainable Electrification Approach
  Moritaka Yoshida Managing Officer, Toyota Motor Corp.	Rudolf Krebs Executive Vice President, Head of Group E-Traction, Volkswagen AG	Nancy Gioia Director, Global Electrification, Ford Motor Company

• Light-K Block (For other Exhibit)

  

  Light-K Keynote Session

  Jan. 18 [Wed] 13:30-15:30 Corporate Strategies of Global Lighting Manufacturers

  Session Leader： Yoshiteru Sato, New Energy and Industrial Technology Development Organization
  Simply Enhancing Life with Light	Creating Tomorrow: Mastering the Transition to SSL Lighting	Paradigm Shift of General Lighting by LED and New Product Strategy of Toshiba
  Marc de Jong CEO, Business Group Professional Lighting Solutions, Executive Vice President, Philips Lighting	Carsten Setzer Senior Vice President, General Lighting Development, OSRAM AG	Koji Sato Vice President & General Manager, LED Business Group, Toshiba Lighting & Technology Corp.

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  ＜Concurrent Shows: Special Sessions＞

• ICP-S1 Block (For other Exhibit)

  

  ICP-S1 Special Session 1

  Jan. 19 [Thur] 16:15-17:00 Lecture by Leading Authority in Automotive Semiconductor Packaging Field

  Automotive Electronics ―Packaging as Enabler Technology

  Andreas Knoblauch Director Package Development Automotive, Infineon Technologies AG

• ICP-S2 Block (For other Exhibit)

  

  ICP-S2 Special Session 2

  Jan. 20 [Fri] 9:30-10:15 Current Industry Trend in China

  Development of Chinese Electronic Industry and Semiconductor Package

  Noriyoshi Kuromasa Shanghai Bureau Chief, Sangyo Times, Inc.

• ICP-S3 Block (For other Exhibit)

  

  ICP-S3 Special Session 3

  Jan. 20 [Fri] 12:30-13:15 Lecture by Taiwan's No.1 LED Manufacturer

  LED Packaging Technology Impact on Lighting Applications

  Ilkan Cokgor Vice President, Global Marketing, Everlight Electronics Co., Ltd.

• (Honorifics omitted)

  * Please note that the speakers and programs are subject to change.
  * The photographic and video recording rights are reserved to the Show Management.
  *Textbooks of some sessions are not available.
  

  For more information, please contact: inw-con@reedexpo.co.jp

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  Asia's Largest Scale! Learn the cutting-edge in 185 sessions.

  Choose and Click the ones of your interest for details.

  

  Latest technologies and industry trends will be addressed; from Lead-free Soldering, Micro Joint, Cutting-edge Testing Technologies, to Applications to the hottest fields such as Smartphones, Power Modules, etc.

  

  3 Dimensional Assembly, TSV, Copper Wire, In-vehicle Semiconductors, Power Devices, etc., the latest technology trends of IC Packaging.

  

  Device Embedded Substrates, Printed Electronics, Heat-resistant Technologies, FPC etc., the latest technologies and industry trends of PCBs.
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  EV/HEV, Motors, Secondary Batteries, Safety Technologies, the Key to Grab the Emerging Markets, etc., hottest topics in the industry.

  

  Industry trends, Strategies of leading companies, Element technologies, etc., various approaches to LED & OLED Lighting.