【INJ-8】Forefront of Power Device Mounting and Heat Radiation Technologies

Technologies for a High Temperature & High Power Density All-SiC Inverter Unit

［Speaker］
Yoshinori Murakami
Chief Researcher,
R&D Center,
R&D Partnership for Future Power Electronics Technology

[Abstract]
The technologies, which exert the potential of SiC power semiconductor devices, utilized in an inverter unit prototype "NIJI" having a power density of 40kW/L will be presented.

Trend of High Thermal Conductive Substrate for Power Module

［Speaker］
Kenji Monden
Group Leader,
Materials Characterization Dept.,
Central Research Institute,
Denki Kagaku Kogyo Kabushiki Kaisha

[Abstract]
The substrates are used in applications where electric parts generate intense heat, such as electric-vehicle, car and so on. It is expected that the insulator of substrate has higher thermal conductivity as the use of a substrate is expanded.

High-reliable and Pb-free Soldering Materials for Power Devices

［Speaker］
Hayato Hiwatashi
Project Manager,
Smart Grid Initiative,
Senju Metal Industry Co., Ltd.

[Abstract]
Introduce the Characteristics of High-Reliable Solder Materials of Power Devices aimed at Increasing Market Demands.

(Honorifics omitted)

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For more information, please contact: inw-con@reedexpo.co.jp.